Curing Agent for Integrated Circuit - Electronics and Computers

MTHPA is often used for casting, potting, impregnation, lamination, bonding, molding, and winding processes, mainly used as a curing agent for epoxy resins. In the field of reinforced plastics, due to its wear resistance and toughness, it is used for filament wound products (pipes for oil, FRP, poles and sport goods), laminated sheets, circuit boards, switches.