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  • laytec

Laytec Xprt Equipment & Supplies

8 equipment items found

LayTec - Spectral Systems

LayTec - Spectral Systems

Manufactured by:LayTec AG   based inBerlin, GERMANY
ayTec has customized and expanded EpiTT's performance for VCSEL epitaxy: The new EpiTT VCSEL combines spectral reflectance measurements with the robust and industry proven EpiTT performance. EpiTT VCSEL contains two fiber optical heads: one for a standard EpiTT and one for spectral reflectance ...
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LayTec Flames - Multi-Head Optical Metrology System

LayTec Flames - Multi-Head Optical Metrology System

Manufactured by:LayTec AG   based inBerlin, GERMANY
LayTec Flames is a multi-head optical metrology system for monitoring multi-layer thin-film structures in large area processes. It measures multi-traces of layer thickness, reflectance, and transmittance uniformity directly after the deposition in in-line processes with thickness resolutions down to less than 1 ...
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LayTec EpiX - Mapping Stations

LayTec EpiX - Mapping Stations

Manufactured by:LayTec AG   based inBerlin, GERMANY
EpiX Mapping stations combine an XY-mapping stage with LayTec spectroscopic reflectance and photoluminescence metrology systems for a comprehensive 2D analysis of optical wafer properties by non-contact measurements. Integrated software provides full automated data analysis, including detection of VCSEL optical parameters (cavity dip, stop-band position), single layer and multiple layer thickness ...
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LayTec - Model IL - Metro Stations

LayTec - Model IL - Metro Stations

Manufactured by:LayTec AG   based inBerlin, GERMANY
ILMetro stations combine up to five LayTec in-line metrology systems for a comprehensive control of industrial thin-film production processes by non-contact measurements. Each station can be customized to specific requirements and hence usually comprises a different combination of metrology systems. ...
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LayTec EpiCurve - Model TT - Wafer Curvature Measurements  System

LayTec EpiCurve - Model TT - Wafer Curvature Measurements System

Manufactured by:LayTec AG   based inBerlin, GERMANY
To overcome the challenges that occur with larger wafers (4', 6' or 8'), you need the advanced EpiCurve® TT system. It combines wafer curvature measurements with all the features of the EpiTT: emissivity-corrected pyrometry and growth rate/thickness measurements by three-wavelength reflectance. This tool will help you avoid cracks, achieve flat wafers and control temperature homogeneity. ...
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LayTec - Model EpiTT - Combines Measurements Instruments

LayTec - Model EpiTT - Combines Measurements Instruments

Manufactured by:LayTec AG   based inBerlin, GERMANY
EpiTT combines measurements of temperature and reflectance at three wavelengths in one tool. For True Temperature (TT), we apply the method of Emissivity Corrected Pyrometry, which delivers the precise surface temperatures of opaque materials at 950 nm (Si, GaAs, InP). For materials that are transparent at 950 nm (GaN, Sapphire, SiC), EpiTT measures the temperature on the top side of the ...
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LayTec PearL - Monitoring Analyzes System

LayTec PearL - Monitoring Analyzes System

Manufactured by:LayTec AG   based inBerlin, GERMANY
The PearL monitoring system analyzes the spectrum of photoluminescent radiation emitted from a probed surface after excitation with laser light. It is designed for in-line integration in production lines. Spectroscopic photoluminescence (sPL) gives access to information on the band gap, electronic defects and the related composition of materials, e.g. the gallium / (gallium+indium) ratio ...
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LayTec - Model X Link - Ethylene Vinyl Acetate System (EVA)

LayTec - Model X Link - Ethylene Vinyl Acetate System (EVA)

Manufactured by:LayTec AG   based inBerlin, GERMANY
In solar modules, the ethylene vinyl acetate (EVA) or polyolefin encapsulation protects the sensitive solar cells from the environment. In consequence the degree of intermolecular cross-linking of EVA or polyolefin is decisive for the long-term stability and performance of a module. Cross-linking is achieved by thermally curing the polymers during the lamination process. ...
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