Incellplate

Integrated equipment and process solutions offer the most attractive alternative to any selective emitter approach.

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Ni, Ag plating
LIEP Ag process owned by Mac Dermid
Suitable for Cu-technology
Patented single side inline plating
No backside protection required
Reduction in Ag consumption compared to all available printing technologies up to 50 %
High uptime due to dry soft touch backside contacting
Low contact finger broadening
Efficiency increase up to 0.6 % for Ni/Ag directly on silicon, depending on laser process
Self aligning metallisation into laser opened structures
Ag reclaim system – SH+E GROUP
Up to 50 % Ag reduction on front side
Contacting of high-ohmic emitters
Efficiency increase up to 0.3 %*
Depending on fine line print

Features And Benefits