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UniTemp - Model RSS-160-S -Mini Vacuum Reflow System
FromUniTemp GmbH
The RSS-160-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas. The heating plate is heated by heating cartridges and has a heated area with 160x160mm. It is made of aluminium. The excellent cooling rates are based on a water cooled chamber.Requires water cooling.
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- flux-less soldering
- flip chip process
- adhesive bonding
- solder bump reflowing
- encapsulation of housings
- soldering of power devices
- heat treatment of semiconductor wafers
- prototype development
- quality control
- Max. substrate size: 160 x 160 mm
- Max. temperature: up to 400 °C, optionally up to 500 °C
- T° continious : 400 °C
- Ramp up rate: 100 K/Min.
- Ramp down rate: up to 100 K/Min.
- Substrate cooling: water cooled
- Chamber cooling: water cooled channels
- Vacuum : up to 10exp.-3 hPa, integrated pressure sensor
- Flow meter: Mass Flow Controller for Nitrogen and other inert gases
- Gases: Inert gases, other on request
- Controller: SIMATIC© with 7" Touch Panel
- Heating plate: Aluminium
- Chamber height inside: 40mm, optionally 80 mm
- Programs: 50 programs saveable
- Formic acid module: 40ml vessel, to be filled manually
- Hydrogen module: on request
- USB Camera: Process viewing by USB camera system on top
- Dimension: 330x420x255 mm
- Weight: 20 kg
- Power : 1 Phase, 230V, 50/60Hz or 100-115V or 200-208V