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Model SOL205S -New Lower Silver Content Back-side Metallization Paste

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Heraeus continues to reduce the silver content per cell with the introduction of SOL205S, a modification to our SOL205, with a reduced silver content. SOL205S is a back-side tabbing Ag conductor paste for mono and multicrystalline silicon solar cells. SOL205S requires less paste per cell than previous generations and maintains the advantage of printability ease and excellent cell adhesion. SOL205S is a Pb and Cd free material that has excellent solderability in both lead and lead-free solders.

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  • Reduced silver content
  • Low paste consumption
  • Excellent solderability
  • High adhesion strength using Pb or Pb-free solders
  • Ease of printability
  • Cd and Pb Free
  • Co-fireable with back-side Al and front-side Ag pastes
  • Wafer Types: Mono and multicrystalline
  • Printed Thickness (Fired): 4 – 8 μm
  • Solid Content: 55.0 ± 1%
  • Viscosity 
    HBT Cone and Plate Viscometer (Brookfield):
    70 – 130 kcps;
    CPE-51 spindle, @ 10 rpm, 25°C