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  5. Onto - Model JetStep S3500 - Panel ...

Onto - Model JetStep S3500 -Panel Lithography System

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The JetStep S3500 panel lithography system is specifically designed for advanced packaging panel production. As fan-out packages increase in size and complexity, requiring panel substrates instead of wafers, the JetStep S3500 system addresses these challenges with advanced features.

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The JetStep S3500 system is designed to provide OSATS?with a high-volume manufacturing advanced packaging lithography solution. For substrates up to 650mm x 650mm, it supports fan-out panel level packaging.

It handles die shift caused by placement accuracy errors, CTE mismatch and panel warpage. The system incorporates a large exposure field (59.4 x 59.4mm) with resolution capability to 2/2 L/S and options for increased resolution to 1/1. In addition, it supports multiple exposure wavelengths, ideal for process development with new photosensitive polymers. Application-specific options include warped panel handling, “on-the-fly” optical focus, and die shift correction (StepFAST™ Solution), helping to ensure precise and reliable panel-level packaging.

  • Fan-out panel level packaging (FOPLP)
  • Interposers
  • Photo imageable Dielectric (PID) vias
  • Redistribution lines (RDL) / Under bump metallization (UBM)
  • Non-standard substrates