Drying: Ceramic lamps/hot air/thermal plate/oven
Sintering: Hot press, hot plate conveyor
Application: Conductive Nano Copper Ink for Additive Printing
Common Application: printing, UHF, NFC,HF RFID antennas on a paper substrate

TYPICAL PROPERTIES: UNCURED NANO COPPER PASTE

Particle Size, μm D50 < 0.15, D90 < 3.0
Solid Content, after 30 minutes @150ºC, 81.7±0.3%
Density, 2.9 g/ml
Viscosity @ r.t. , DVEHA Brookfiled spindle 14, mPa·s (cps) 1800-2200
Thixotropic Index (1.5/15 s-1) 1.4-1.6
Coverage area @5μm dry film thickness, 20.9 m²/kg
Shelf Life, @<-10°C, 180 days
Flash Point – See Safety Data Sheet (SDS)

Drying and Sintering:
Copprint LF-301 may be dried employing dry hot air, (near) infrared or ceramic lamps.
Drying cycle: 15 sec @150°C (Ceramic lamps)
Sintering cycle: 5 sec @ 260°C-310°C (Laminator) or 8-20 sec @ 240°C (Hot roller)

*Conditions (time / temperature) may vary based on application requirements, drying equipment, oven loading and actual temperatures.

TYPICAL PROPERTIES: CURED NANO COPPER PASTE

Adhesion: tape test 3M Scotch 234 (Passed)
Electrical Properties: Sheet Resistance, ohm/?/25 μm <0.003

DIRECTIONS FOR NANO COPPER INK USE

Copprint LF-300 is supplied as a single-component formulation ready for use.

SCREEN PROPERTIES

Emulsion, Solvent resistant emulsion: 10 to 40 μm
Squeegee Shore Hardness: 70 to 90 Shore
Screen Type: Polyester screen, mesh 90 to 200 Shore

EQUIPMENT MAINTENANCE & CLEAN-UP

Equipment can be cleaned with Dowanol DB followed by aqueous solution which includes 10-20% w/w 2-amino-2-methyl-1-propanol. See Application Notes.

STORAGE AND HANDLING

Store sealed container under -10°C in a dry location.
(Storage above 30°C can adver-10sely affect product properties.)

Paste removed from containers may be contaminated during use. Do not return Paste to the original container. Copprint is not responsible for paste which has been contaminated or stored under faulty conditions

Copprint - Model LF-301 -Paste for Paper Substrate

Details