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  5. VERSALINE - Semiconductor Processing ...

VERSALINE - Semiconductor Processing Systems

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The VERSALINE platform from Plasma-Therm is engineered to support a broad spectrum of applications within the specialty semiconductor markets, primarily focusing on etching and deposition processes. With its modular design, VERSALINE allows for flexible substrate handling configurations, making it suitable for both research and development and high-volume production environments. The platform incorporates several advanced technologies, including Ion Beam Etch (IBE), Ion Beam Deposition (IBD), and various types of plasma-enhanced chemical vapor deposition (PECVD). These systems are known for their high uniformity, throughput, and cost-efficiency. The onboard Cortex control system ensures user-friendly operation with features like EndpointWorks for enhanced process control. Versatility is enhanced with options for inductive coupled plasma (ICP), deep silicon etching (DSE), and high-density radical flux (HDRF) technology, catering to diverse semiconductor processing needs from low-damage etching to high-aspect-ratio applications.
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VERSALINE system models are configured to perform an array of etch and deposition processes. Ion beam technology suits a range of applications, from low, controllable damage etching to high-rate, high-aspect-ratio, deep silicon etching to difficult materials. The systems support process control through EndpointWorks®. Enhancements include data logging, automated maintenance scheduler (AMS), and SECS/GEM. Our Cortex® control system provides a stable, user-friendly control interface designed for efficiency and productivity.

The VERSALINE platform’s modular design allows for flexible configuration of substrate handling for a variety of handling options, from R&D single wafer or carrier loading with a loadlock to high-volume, multi-chamber production clusters. Clear upgrade paths that leverage costs and process development make future planning easy. 

  • LL: Loadlock for single substrate or single batch carrier. Upgradable to cassette loading.
  • CX: For cassette and cluster configuration (up to 75mm to 200mm capable)