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W&L Coating Systems GmbH
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  5. W&L - Model NMS 250 and NMS-BM 270 - ...

W&L - Model NMS 250 and NMS-BM 270 -Table Top Sputtering Systems

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The NMS 250 and NMS-BM 270 are innovative sputtering systems designed for the material-efficient physical vapor deposition (PVD) of precious metals and other conductive materials on three-dimensional substrates. These systems are engineered to minimize the use of expensive coating materials by ensuring that the sputtered material not deposited on the substrates returns to the sputter target for further use. This closed-loop design significantly enhances material utilization and eliminates wastage. The small, front-side copper shields on the systems absorb any residual sputtered material, which can be easily recycled. The NMS 250 is compact and ideal for smaller series, providing a coating volume of approximately 200 mm in length and 60 mm in diameter, making it suitable for precise, high-quality coatings of individual parts. The NMS-BM 270, on the other hand, caters to bulk material coatings up to 0.3 liters, operating with a coating rate varying between 5 to 20 nm/min depending on the material and process. Both systems are designed for economical, high-quality sputtering, require no specialist personnel, and feature a programmable logic controller (PLC) with an integrated computer and display for easy operation. They also allow quick target material changes and maintain low vacuum base pressure for high productivity, making them ideal for a range of functional and decorative applications.
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The NMS 250 and NMS-BM 270 are sputtering systems for material-saving physical vapor deposition (PVD) of precious metals and other conductive materials on 3D substrates. Specially developed to save expensive coating materials, they are able to coat 3D objects “in house” evenly in an economical and cost-saving manner.

The special, cylindrical target design of the systems ensures that the sputtered material that is not deposited on the substrates returns to the sputter target and is therefore immediately available for further coating.

The sputtered material that is not redeposited onto the sputtering target is absorbed by the systems comparatively small, front-side copper shields, which can be easily recycled. In this way, material utilization is maximized and the loss of valuable material is reduced to zero - in contrast to conventional sputtering systems.

• Economical, high-quality coatings of complex, three-dimensional objects
• Highly productive batch coating system
• No loss of valuable sputtering target materials
• Environmentally friendly
• Quick and easy exchange of the target material
• No specialist personnel required to operate the system

The special, cylindrical target design of the systems ensures that the sputtered material that is not deposited on the substrates returns to the sputter target and is therefore immediately available for further coating.

The sputtered material that is not redeposited onto the sputtering target is absorbed by the systems comparatively small, front-side copper shields, which can be easily recycled. In this way, material utilization is maximized and the loss of valuable material is reduced to zero - in contrast to conventional sputtering systems.

  • Economical, high-quality coatings of complex, three-dimensional objects
  • Highly productive batch coating system
  • No loss of valuable sputtering target materials
  • Environmentally friendly
  • Quick and easy exchange of the target material
  • No specialist personnel required to operate the system

The NMS 250 coating system is suitable for sputtering individual parts or small series of 3D objects with a coating volume of ~200 mm in length and ~Ø 60 mm.

A compact and economical “desktop” magnetron sputtering system for precious metals. With a target length of 250 mm, suitable for coating individual parts. It takes less than 10 minutes from loading to igniting the plasma discharge. A target change can be carried out in a few seconds.

small series sputtering of bulk materials

The NMS-BM 270 bulk material coating system is designed for sputtering small series of 3D objects with a total bulk material volume of up to 0.3 liters.

It takes less than 10 minutes from loading to igniting the plasma discharge. The coating rate is ~ 5 – 20 nm/min, depending on the material and process.

A target change can be carried out in less than 10 minutes.

Before deposition, the substrate may be etched or cleaned as a pretreatment using inverse magnetron sputtering. In the subsequent sputtering process, precious metals or other materials will be deposited onto the 3D objects in a highly efficient and material-saving manner.
Different target materials can be kept ready for quick process changes.