Kerafol Keramische Folien GmbH & Co. KG
Keratherm - Thermal Compounds
Thermal Compounds can well be used for encapsulating whole applications and for dispensing housing lids or heat sinks. Thanks to its easy usage, it allows even the most complicated geometries to be encapsulated.
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- outstanding adaptability and compressibility
- low mechanical tension
- high thermal conductivity
- long term stability
- compatible with industrial production sequences
- RD-RAM modules
- memory chips
- chipsets
- micro BGA
- heat pipe applications
- high voltage electronic components