UniTemp GmbH
UniTemp - Model RSS 3X210-S -Vacuum Reflow System
FromUniTemp GmbH
Vacuum Reflow System with SIMATIC© control for substrate size up to 3 x (200 x 200 mm) Lift pins for wafer lift up and down. The RSS-3X210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas.
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The reflow solder system is perfect for the following applications:
- flux-less soldering
- flip chip process
- adhesive bonding
- solder bump reflowing
- soldering of power devices
- heat treatment of semiconductor wafers
- prototype development
- quality control
- heated area: 3 heated plates with each 210 mm x 210 mm
- chamber height: 40 mm (optional up to 80 mm)
- Mass Flow controller for Nitrogen (5 nlm)
- vacuum atmosphere up to 10exp.-3 hPa (KF16 connector)
- temperature up to 300 °C (higher on request)
- ramp up rate: better 120 K/minute
- ramp down rate: better 60 K/minute
- SIMATIC© process control with 50 programs and 50 steps each
- 7" touch panel
- water cooled chamber (controlled and watched)
- electrical connection type: 3x 230V,3P, +N, 18 kW