LSP Technologies, Inc.
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Laser Bond Inspection Services

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Laser Bond Inspection is an LSP Technologies created process for the non-destructive strength testing of bonded structures. The technology helps to ensure quality in bonded structures where other technologies have severe limitations and inadequacies.

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Production Capabilities

  • AS9100C registered quality system
  • Two in-house laser bond inspection systems
  • Mobile laser bond inspection unit
  • Production staff operating 2 - 3 shifts
  • EMAT and UT equipment for post-evaluations
  • C-Scan capabilities

Job Shop, Engineering & Application Development Services

Laser Bond Inspection is an emerging technology that meets the non-destructive demands of high performance bonded structures. Being a new technology, it is often necessary to devote engineering and development efforts towards specific combinations of materials, adhesives, and different layups of structures. If you are interested in learning more about laser bond inspection and potential application to your products, give us a call and we`ll be happy to talk with you.

Development Capabilities

  • AS9100C registered quality system
  • Library of tested components and materials
  • A-scan, B-scan, and C-scan UT signatures from different bond types
  • Detect weak or kissing bond structures
  • Detect flaws in structures otherwise masked