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Xprt Product Applications Available In Egypt

15,247 applications found
Available In EgyptNear Egypt

Ultra High Temperature Solar Technology for Microgrid Energy

Ultra High Temperature Solar Technology for Microgrid Energy

247Solar products integrate with all power generation and management technologies to create clean microgrids that operate 24/7 with increased resilience and flexibility. They complement PV, wind and short duration batteries to enable microgrids to match power generation with electricity demand around the clock in any ...

By247Solar Inc.  based in  Great Falls, VIRGINIA (USA)


Ultra High Temperature Solar Technology for Off-Grid Electricity & Heat

Ultra High Temperature Solar Technology for Off-Grid Electricity & Heat

Before now, sources of clean power were unreliable. Electricity was available only when the sun was shining or the wind was blowing. Storing energy for later use required costly batteries. Off-grid PV and wind installations required back-up generators that burned non-renewable diesel to provide power around the clock under all weather conditions. Today, continuous clean electricity is a reality – day and night in any weather. 247Solar technologies store the sun’s energy as heat instead of electricity ...

By247Solar Inc.  based in  Great Falls, VIRGINIA (USA)


Aerobic Digester for Maritime

Aerobic Digester for Maritime

Cruise Ships, Navy Ships, Submarines, and LNG Tankers ...

ByRecoup Technologies, Inc.  based in  Warren, MICHIGAN (USA)


Aerobic Digester for Government

Aerobic Digester for Government

Federal, State, and Local Prisons and Offices ...

ByRecoup Technologies, Inc.  based in  Warren, MICHIGAN (USA)


Aerobic Digester for Healthcare

Aerobic Digester for Healthcare

Hospitals, Nursing Homes, and Assisted Living ...

ByRecoup Technologies, Inc.  based in  Warren, MICHIGAN (USA)


VIEW Semiconductor Advanced Packaging Applications - Flip Chip

VIEW Semiconductor Advanced Packaging Applications - Flip Chip

Flip chip processes present a number of critical metrology challenges including the need for precise three-dimensional measurements to accurately inspect pad size, position, and distance from the package edges as well as confirming acceptable flatness and ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Advanced Packaging Applications - MEMS

VIEW Semiconductor Advanced Packaging Applications - MEMS

Measure a wide variety of critical dimensions on MEMS devices, including pitch, width, and spacing of flexures, fingers, combs, arcs, circle diameters, and center locations. Because of the myriad of requirements for MEMS devices, they can range from a few microns in size to a few millimeters. ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Connector Measurement

Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Connector Measurement

As the leader in microelectronics metrology solutions for more than two decades, VIEW brings together the applications awareness and metrology expertise needed to address even the most demanding interconnection challenges with proven platforms. Some of the specific microelectronics interconnection applications that are addressed by VIEW solutions are listed ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Connectors

VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Connectors

The effective inspection of PCB connectors requires metrology solutions that can accurately measure a wide variety of connector dimensions while providing the fast cycle times and throughput required for high-volume near in-line production-oriented processes. Efficient and highly repeatable measurement capabilities are needed to quickly acquire data on lead (male) and slot (female) connector positions along with size, pitch, and coplanarity ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring -  Fiber Optics

Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Fiber Optics

Metrology solutions for fiber optic interconnect components (“ferrules”) require high accuracy and throughput. One of the critical dimensions is the concentricity of the outer housing to the fiber optic center. This ensures proper interface to support high-speed communications ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Wire Bond Applications - Wire Bonding Metrology

VIEW Semiconductor Wire Bond Applications - Wire Bonding Metrology

The small features, fragile connections, and critical three-dimensionality of wire bonded assemblies require high-performance, non-contact metrology solutions. Functions such as multiple magnification, creative lighting, and advanced image processing are needed in order to measure critical features such as ball and tooling mark diameters, placement and pad alignment, and wire loop ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Wire Bond Applications - Quad Flat Packs (QFP) and Ball Grid Arrays (BGA)

VIEW Semiconductor Wire Bond Applications - Quad Flat Packs (QFP) and Ball Grid Arrays (BGA)

Quad Flat Pack (QFP) and Ball Grid Array (BGA) components represent metrology challenges with very tight tolerances that can tax the capabilities of even high performance ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Advanced Packaging Applications - Fan-out Wafer Level Packaging

VIEW Semiconductor Advanced Packaging Applications - Fan-out Wafer Level Packaging

Accurate metrology is needed in FOWLP to inspect wafer warpage, die position/alignments, flatness/coplanarity, through-silicon vias, solder microbump heights, UBM layers, RDL lines, and other alignments and features. VIEW Micro Metrology systems and software are ideal for this type of work by providing high-accuracy measurement, high-throughput speed, and production line ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Semiconductor Tooling - Inkjet Nozzle

Microelectronics Metrology Solutions for Semiconductor Tooling - Inkjet Nozzle

Measure orifice diameter and position with sub-micron accuracy. Measurement of orifice diameters Relative alignment of top/bottom orifices Orifice diameter/position measurement accuracy of < 10 nm ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Tooling Applications - Stencil Process Control

VIEW Semiconductor Tooling Applications - Stencil Process Control

Precision stencils for SMT solder paste printing represent a critical linchpin in the achievement of overall productivity and quality manufacturing results within the electronics industry. High-end metrology systems play a vital role in the assurance of the stencil quality needed for producing consistent production ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Artwork and Bare Boards

VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Artwork and Bare Boards

Inspection and process control for maintaining quality assurance over PCB artwork and bare-boards represent especially challenging requirements for metrology ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - Solder Paste Metrology

VIEW Printed Circuit Board (PCB) Inspection Applications - Solder Paste Metrology

Mis-registration of solder paste relative to printed circuit board pads is one of the leading causes of scrap and rework in surface mount technology (SMT) board assembly. In addition, height and volume measurements are crucial to new process development and to the optimization of existing ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - HDD ETCH Dimension

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - HDD ETCH Dimension

Precision etch dimension measurement of hard disk heads. In order to reliably produce hard disk heads with proper performance, a disk head manufacturer must be able to measure the etch dimensions accurately. The required precision can be on the order of a few tenths of a micron or less, requiring nanometer-level detection of the pole tip and the locations of the various edges of the etched steps. ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Head Gimbal Assembly HGA Inspection

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Head Gimbal Assembly HGA Inspection

Production inspection of hard drive Head Gimbal Assemblies (HGAs) requires the accurate measurement of a number of critical factors to meet tight tolerances. These include pitch and roll angles, slider positioning, and slider orientation/alignment ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Slider Inspection

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Slider Inspection

Slider inspection is a critical data storage manufacturing process that presents difficult challenges from a metrology perspective. Slider inspection requires the acquisition and measurement of relatively small feature sizes with tight tolerances while also demanding short cycle times to provide high throughput for large production ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)

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