Metrology Software Product Applications

3 applications found

VIEW Semiconductor Advanced Packaging Applications - Fan-out Wafer Level Packaging

Accurate metrology is needed in FOWLP to inspect wafer warpage, die position/alignments, flatness/coplanarity, through-silicon vias, solder microbump heights, UBM layers, RDL lines, and other alignments and features. VIEW Micro Metrology systems and software are ideal for this type of work by providing high-accuracy measurement, high-throughput speed, and production line ...

ByVIEW Micro Metrology based in Rochester, NEW YORK (USA)

Measurements Solutions for Radius of Curvature

ZYGO laser interferometers are powerful and precise instruments for measurement and characterization of optical components and systems. One of the most common applications include the measurement of the radius of curvature. The radius of curvature is a fundamental and functional parameter of spherical optical surfaces, which requires quality control during ...

ByZygo Corporation - AMETEK, Inc based in Middlefield, CONNECTICUT (USA)

Measurements Solutions for Micro-Electromechanical Systems (MEMS)

Micro-electromechanical systems, or MEMS, have become critical components in a variety of consumer and industrial products, including things inkjet printers, cellular phones and accelerometers for automobile airbags. MEMS devices are typically manufactured in high volumes, often using modified semiconductor processes, to exacting specifications. For MEMS manufacturers to meet high production standards, these devices need to be measured at various steps of the design, fabrication and production ...

ByZygo Corporation - AMETEK, Inc based in Middlefield, CONNECTICUT (USA)

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