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Metrology System Product Applications

34 applications found

Microelectronics Metrology Solutions for Precision Micro-Grinding - Watch Components

Microelectronics Metrology Solutions for Precision Micro-Grinding - Watch Components

The accurate measurement of precision watch components places a number of special challenges on metrology systems used for inspection and process control. The small part sizes, variety of shapes, different gear geometries, and tight clearance specifications are all critical considerations when designing a metrology application for process control and inspection of watch ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - Flex Circuits

VIEW Printed Circuit Board (PCB) Inspection Applications - Flex Circuits

Flex circuit technologies pose a wide range of metrology challenges with a large number of different circuit geometries, pitch dimensions, and surface reflectivity factors. To meet these challenges, metrology systems for flex circuit inspection must incorporate advanced functionality such as versatile lighting, large-size stages, high-resolution positioning, and very accurate laser probe capabilities. ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Wire Bond Applications - Lead Frames

VIEW Semiconductor Wire Bond Applications - Lead Frames

Leadframe inspection presents a wide variety of feature sizes and geometry, requiring metrology systems that can be flexibly programmed for fast and accurate three-dimensional measurements. ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Precision Micro-Grinding - End-Mill Cutting Tools

Microelectronics Metrology Solutions for Precision Micro-Grinding - End-Mill Cutting Tools

Precision cutting tools such as end mills represent especially difficult process control challenges for metrology systems because they require extremely precise features, dimensions, and cutting surfaces in order to deliver consistent results when deployed within demanding machining ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Advanced Packaging Applications - Fan-out Wafer Level Packaging

VIEW Semiconductor Advanced Packaging Applications - Fan-out Wafer Level Packaging

Accurate metrology is needed in FOWLP to inspect wafer warpage, die position/alignments, flatness/coplanarity, through-silicon vias, solder microbump heights, UBM layers, RDL lines, and other alignments and features. VIEW Micro Metrology systems and software are ideal for this type of work by providing high-accuracy measurement, high-throughput speed, and production line ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Precision Micro-Grinding - Fuel Injector Components

Microelectronics Metrology Solutions for Precision Micro-Grinding - Fuel Injector Components

Quality assurance and inspection of critical automotive components such as precision nozzles require metrology systems that can effectively combine both extremely accurate measurement and a high-level of process flexibility. ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Tooling Applications - Stencil Process Control

VIEW Semiconductor Tooling Applications - Stencil Process Control

Precision stencils for SMT solder paste printing represent a critical linchpin in the achievement of overall productivity and quality manufacturing results within the electronics industry. High-end metrology systems play a vital role in the assurance of the stencil quality needed for producing consistent production ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Artwork and Bare Boards

VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Artwork and Bare Boards

Inspection and process control for maintaining quality assurance over PCB artwork and bare-boards represent especially challenging requirements for metrology ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Component Placement

Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Component Placement

Component placement verification in electronic assemblies presents metrology challenges that are almost as wide and varied as the range of electronic designs and the types of components used. Key process control parameters that must be measured include component positioning and rotation (X, Y, and theta) relative to pads, as well as checking for missing and/or damaged ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Readwrite Heads

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Readwrite Heads

Inspection processes for read/write heads require high-precision non-contact metrology functions to control tight Z-axis tolerances in the read/write gap measurements and Z dimension variations from the side rails to the top surface of pole-tip ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Connectors

VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Connectors

The effective inspection of PCB connectors requires metrology solutions that can accurately measure a wide variety of connector dimensions while providing the fast cycle times and throughput required for high-volume near in-line production-oriented processes. Efficient and highly repeatable measurement capabilities are needed to quickly acquire data on lead (male) and slot (female) connector positions along with size, pitch, and coplanarity ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Wire Bond Applications - Wire Bonding Metrology

VIEW Semiconductor Wire Bond Applications - Wire Bonding Metrology

The small features, fragile connections, and critical three-dimensionality of wire bonded assemblies require high-performance, non-contact metrology solutions. Functions such as multiple magnification, creative lighting, and advanced image processing are needed in order to measure critical features such as ball and tooling mark diameters, placement and pad alignment, and wire loop ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Head Gimbal Assembly HGA Inspection

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Head Gimbal Assembly HGA Inspection

Production inspection of hard drive Head Gimbal Assemblies (HGAs) requires the accurate measurement of a number of critical factors to meet tight tolerances. These include pitch and roll angles, slider positioning, and slider orientation/alignment ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Measurements Solutions for Defense

Measurements Solutions for Defense

Serving the needs of the Military and Aerospace industry requires a high level of quality and commitment. With mission-critical programs and applications, failure is not an option. Success demands the highest standard of precision, reliability, and quality, enabled with close ...

ByZygo Corporation - AMETEK, Inc  based in  Middlefield, CONNECTICUT (USA)


Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Connector Measurement

Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Connector Measurement

As the leader in microelectronics metrology solutions for more than two decades, VIEW brings together the applications awareness and metrology expertise needed to address even the most demanding interconnection challenges with proven platforms. Some of the specific microelectronics interconnection applications that are addressed by VIEW solutions are listed ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Semiconductor Tooling - Inkjet Nozzle

Microelectronics Metrology Solutions for Semiconductor Tooling - Inkjet Nozzle

Measure orifice diameter and position with sub-micron accuracy. Measurement of orifice diameters Relative alignment of top/bottom orifices Orifice diameter/position measurement accuracy of < 10 nm ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Slider Inspection

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Slider Inspection

Slider inspection is a critical data storage manufacturing process that presents difficult challenges from a metrology perspective. Slider inspection requires the acquisition and measurement of relatively small feature sizes with tight tolerances while also demanding short cycle times to provide high throughput for large production ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Suspension Flexure Inspection

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Suspension Flexure Inspection

Inspection of data storage flexure suspension assemblies requires extremely accurate and repeatable metrology capabilities, along with special features such as integrated laser auto-focus, versatile lighting, multiple magnifications, and highly programmable ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Measurements Solutions for Dimensional Analysis

Measurements Solutions for Dimensional Analysis

ZYGO can extend its capabilities to enable sub-pixel 2D metrology from the same data used to report 3D metrology results. Users have the choice of using either height or intensity data to make these lateral measurements. Parameters such as line and space widths, hole dimensions, and feature to feature relationships are possible. ZYGO’s 2D metrology solutions are not only used for lateral dimensions, but also enable production and automation environments. 2D metrology can be used to identify features for part ...

ByZygo Corporation - AMETEK, Inc  based in  Middlefield, CONNECTICUT (USA)


Microelectronics Metrology Solutions for Precision Micro-Grinding - Electrical Test Probes

Microelectronics Metrology Solutions for Precision Micro-Grinding - Electrical Test Probes

The inspection of electrical test probes requires precision metrology capabilities to accurately measure small features such as the positioning, pitch, and coplanarity of test lead ends. Fast and repeatable precision inspection processes often require a combination of multiple magnifications, high-performance video auto-focus with 50X lens, and/or through-the-lens laser options for rapid Z-axis ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)

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