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Xprt Product Applications In China

3,635 applications found
In ChinaAvailable In ChinaNear China

Heterojunction Technology for Utility

Heterojunction Technology for Utility

Heterojunction technology (HJT) is an advanced solar cell technology that combines the benefits of both crystalline silicon and amorphous silicon thin-film technologies. It uses N-type monocrystalline silicon as a substrate and deposits silicon-based thin films with different characteristics and transparent conductive films on the front and rear surfaces respectively, resulting in an N-type bifacial solar cell. HJT technology has excellent photoabsorption and passivation effects, resulting in the highest ...

ByGolden Solar Technology Co., Ltd  based in  Suzhou, CHINA


Air cleaning system for Healthcare Industry

Air cleaning system for Healthcare Industry

In healthcare, Indoor Air Quality (IAQ) is mission critical. Medical equipment and facilities require increasingly higher levels of air quality. Further, patients, staff, and doctors all expect the air they breathe to be free of pathogens and contaminants. This has led to the use of more robust filtration systems that are able to address particle, biological, and gas phase contaminants. However, since over 90% of the cost of cleaning the air is the cost of the energy to move it through the system, providing ...

ByDynamic Air Quality Solutions  based in  Princeton, NEW JERSEY (USA)


Wind Power Solution for Wind Turbine Smart Control and Power Enhancement

Wind Power Solution for Wind Turbine Smart Control and Power Enhancement

Conventional wind turbine smart control and power enhancement with load reduction mainly rely on feedback control systems. These systems control the yaw mechanism by estimating the wind speed based on the rotor speed to improve wind energy utilization efficiency. However, due to the instability and randomness of wind speed, as well as the turbulence caused by upstream turbines, this control method experiences variable and unstable wind measurements, which can accelerate the wear and aging of the yaw ...

ByQingdao Leice Transient Technology Co., Ltd.  based in  Qingdao, CHINA


Wind Power Solution for Wind Power Prediction

Wind Power Solution for Wind Power Prediction

Wind power prediction is one of the key technologies that urgently needs in-depth research in the large-scale grid integration and development of wind power. Based on the high-precision meteorological observations of the wind farm using Doppler lidar, combined with physical simulation calculations and statistical methods, it is possible to provide short-term forecasts of the wind conditions at the wind farm and predict the power generation of the wind farm, meeting the requirements of the power dispatching ...

ByQingdao Leice Transient Technology Co., Ltd.  based in  Qingdao, CHINA


Meteorology Solution for Meteorological Support for Fire Emergency Rescue

Meteorology Solution for Meteorological Support for Fire Emergency Rescue

Utilizing 3D scanning wind measurement LIDAR, vehicle-mounted wind measurement LIDAR and airborne wind measurement LIDAR, the company provides efficient and accurate wind field and combustion particle characteristics monitoring services for forest fires, urban fires and other emergency rescue scenarios. Through rapid deployment and real-time data collection and analysis, combined with mature meteorological models, it realizes high-precision, high temporal and spatial resolution monitoring and short-term accurate ...

ByQingdao Leice Transient Technology Co., Ltd.  based in  Qingdao, CHINA


VIEW Semiconductor Advanced Packaging Applications - Flip Chip

VIEW Semiconductor Advanced Packaging Applications - Flip Chip

Flip chip processes present a number of critical metrology challenges including the need for precise three-dimensional measurements to accurately inspect pad size, position, and distance from the package edges as well as confirming acceptable flatness and ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Advanced Packaging Applications - MEMS

VIEW Semiconductor Advanced Packaging Applications - MEMS

Measure a wide variety of critical dimensions on MEMS devices, including pitch, width, and spacing of flexures, fingers, combs, arcs, circle diameters, and center locations. Because of the myriad of requirements for MEMS devices, they can range from a few microns in size to a few millimeters. ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Connector Measurement

Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Connector Measurement

As the leader in microelectronics metrology solutions for more than two decades, VIEW brings together the applications awareness and metrology expertise needed to address even the most demanding interconnection challenges with proven platforms. Some of the specific microelectronics interconnection applications that are addressed by VIEW solutions are listed ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Connectors

VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Connectors

The effective inspection of PCB connectors requires metrology solutions that can accurately measure a wide variety of connector dimensions while providing the fast cycle times and throughput required for high-volume near in-line production-oriented processes. Efficient and highly repeatable measurement capabilities are needed to quickly acquire data on lead (male) and slot (female) connector positions along with size, pitch, and coplanarity ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring -  Fiber Optics

Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Fiber Optics

Metrology solutions for fiber optic interconnect components (“ferrules”) require high accuracy and throughput. One of the critical dimensions is the concentricity of the outer housing to the fiber optic center. This ensures proper interface to support high-speed communications ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Wire Bond Applications - Wire Bonding Metrology

VIEW Semiconductor Wire Bond Applications - Wire Bonding Metrology

The small features, fragile connections, and critical three-dimensionality of wire bonded assemblies require high-performance, non-contact metrology solutions. Functions such as multiple magnification, creative lighting, and advanced image processing are needed in order to measure critical features such as ball and tooling mark diameters, placement and pad alignment, and wire loop ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Wire Bond Applications - Quad Flat Packs (QFP) and Ball Grid Arrays (BGA)

VIEW Semiconductor Wire Bond Applications - Quad Flat Packs (QFP) and Ball Grid Arrays (BGA)

Quad Flat Pack (QFP) and Ball Grid Array (BGA) components represent metrology challenges with very tight tolerances that can tax the capabilities of even high performance ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Advanced Packaging Applications - Fan-out Wafer Level Packaging

VIEW Semiconductor Advanced Packaging Applications - Fan-out Wafer Level Packaging

Accurate metrology is needed in FOWLP to inspect wafer warpage, die position/alignments, flatness/coplanarity, through-silicon vias, solder microbump heights, UBM layers, RDL lines, and other alignments and features. VIEW Micro Metrology systems and software are ideal for this type of work by providing high-accuracy measurement, high-throughput speed, and production line ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Semiconductor Tooling - Inkjet Nozzle

Microelectronics Metrology Solutions for Semiconductor Tooling - Inkjet Nozzle

Measure orifice diameter and position with sub-micron accuracy. Measurement of orifice diameters Relative alignment of top/bottom orifices Orifice diameter/position measurement accuracy of < 10 nm ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Tooling Applications - Stencil Process Control

VIEW Semiconductor Tooling Applications - Stencil Process Control

Precision stencils for SMT solder paste printing represent a critical linchpin in the achievement of overall productivity and quality manufacturing results within the electronics industry. High-end metrology systems play a vital role in the assurance of the stencil quality needed for producing consistent production ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Artwork and Bare Boards

VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Artwork and Bare Boards

Inspection and process control for maintaining quality assurance over PCB artwork and bare-boards represent especially challenging requirements for metrology ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - Solder Paste Metrology

VIEW Printed Circuit Board (PCB) Inspection Applications - Solder Paste Metrology

Mis-registration of solder paste relative to printed circuit board pads is one of the leading causes of scrap and rework in surface mount technology (SMT) board assembly. In addition, height and volume measurements are crucial to new process development and to the optimization of existing ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - HDD ETCH Dimension

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - HDD ETCH Dimension

Precision etch dimension measurement of hard disk heads. In order to reliably produce hard disk heads with proper performance, a disk head manufacturer must be able to measure the etch dimensions accurately. The required precision can be on the order of a few tenths of a micron or less, requiring nanometer-level detection of the pole tip and the locations of the various edges of the etched steps. ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Head Gimbal Assembly HGA Inspection

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Head Gimbal Assembly HGA Inspection

Production inspection of hard drive Head Gimbal Assemblies (HGAs) requires the accurate measurement of a number of critical factors to meet tight tolerances. These include pitch and roll angles, slider positioning, and slider orientation/alignment ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Slider Inspection

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Slider Inspection

Slider inspection is a critical data storage manufacturing process that presents difficult challenges from a metrology perspective. Slider inspection requires the acquisition and measurement of relatively small feature sizes with tight tolerances while also demanding short cycle times to provide high throughput for large production ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)

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