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Xprt Product Applications In Japan

1,331 applications found
In JapanAvailable In JapanNear Japan

Measurements Solutions for Specialized Asphere Applications and Analysis

Measurements Solutions for Specialized Asphere Applications and Analysis

Beyond surface characterization, Zygo solutions offer feedback from the metrology setup to aspheric and freeform surface ...

ByZygo Corporation - AMETEK, Inc  based in  Middlefield, CONNECTICUT (USA)


Measurements Solutions for Machined Surfaces

Measurements Solutions for Machined Surfaces

ZYGO 3D optical profiler products utilize non-contact coherence scanning interferometry (CSI) technology to offer precise, rapid and quantitative surface metrology of form and roughness for improved part quality and manufacturing yields. Our field-proven and innovative solutions enable our customers to control their current machining processes, while providing the insight to analyze and solve manufacturing challenges as they ...

ByZygo Corporation - AMETEK, Inc  based in  Middlefield, CONNECTICUT (USA)


Measurements Solutions for Micro-Electromechanical Systems (MEMS)

Measurements Solutions for Micro-Electromechanical Systems (MEMS)

Micro-electromechanical systems, or MEMS, have become critical components in a variety of consumer and industrial products, including things inkjet printers, cellular phones and accelerometers for automobile airbags. MEMS devices are typically manufactured in high volumes, often using modified semiconductor processes, to exacting specifications. For MEMS manufacturers to meet high production standards, these devices need to be measured at various steps of the design, fabrication and production ...

ByZygo Corporation - AMETEK, Inc  based in  Middlefield, CONNECTICUT (USA)


Sustainable energy solutions for robotics sector

Sustainable energy solutions for robotics sector

Robotics is becoming a standard fixture in the operations of many businesses across a wide range of industries. Robotics, particularly when coupled with automation, requires a reliable and efficient energy supply. PJP Eye has seen exciting new applications for its batteries in this field and its Cambrian’s superior specifications are an effective way towards improving asset ...

ByPJP Eye LTD.  based in  Fukuoka, JAPAN


Sustainable energy solutions for satellites sector

Sustainable energy solutions for satellites sector

Cambrian’s proven 8000 life cycles are nowhere more pertinent than in the use of satellites in space. Cambrian has shown to have 80% DOD and 16% degradation, significantly reducing frequency and cost of replacement. The durability and reliability offered by Cambrian is set to make it a key power solution provider for companies in the fast-growing satellite industry. ...

ByPJP Eye LTD.  based in  Fukuoka, JAPAN


Industrial water solutions for zero liquid discharge sector

Industrial water solutions for zero liquid discharge sector

Eliminate Liquid Discharge to the Environment: Zero Liquid Discharge (ZLD) is a strategic, wastewater management system facilities adopt to avoid discharging industrial wastewater into the environment. This is an engineered approach to water treatment, resulting in water recycle, recovery and reuse. Kurita America has developed a five-phase approach to zero liquid discharge projects, allowing our team to engineer the optimal system for industrial facilities. We model and combine various technologies including ...

ByKurita America Inc.  based in  Minneapolis, MINNESOTA (USA)


Water & environmental data acquisition solutions for weather monitoring industry

Water & environmental data acquisition solutions for weather monitoring industry

Weather is the state of the atmosphere that is driven by air pressure, temperature, and moisture differences between one place and another. Many geospatial variables influence such weather drivers. Understandings of what weather is, what makes it change, the effect it has different applications have existed for most of human history. Today, weather understanding, modelling, and forecasting are made by collecting quantitative data about the current state of the atmosphere, land, and ocean by using meteorology data ...

ByStevens Water Monitoring Systems, Inc.  based in  Portland, OREGON (USA)


VIEW Semiconductor Advanced Packaging Applications - Flip Chip

VIEW Semiconductor Advanced Packaging Applications - Flip Chip

Flip chip processes present a number of critical metrology challenges including the need for precise three-dimensional measurements to accurately inspect pad size, position, and distance from the package edges as well as confirming acceptable flatness and ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Advanced Packaging Applications - MEMS

VIEW Semiconductor Advanced Packaging Applications - MEMS

Measure a wide variety of critical dimensions on MEMS devices, including pitch, width, and spacing of flexures, fingers, combs, arcs, circle diameters, and center locations. Because of the myriad of requirements for MEMS devices, they can range from a few microns in size to a few millimeters. ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Connector Measurement

Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Connector Measurement

As the leader in microelectronics metrology solutions for more than two decades, VIEW brings together the applications awareness and metrology expertise needed to address even the most demanding interconnection challenges with proven platforms. Some of the specific microelectronics interconnection applications that are addressed by VIEW solutions are listed ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Connectors

VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Connectors

The effective inspection of PCB connectors requires metrology solutions that can accurately measure a wide variety of connector dimensions while providing the fast cycle times and throughput required for high-volume near in-line production-oriented processes. Efficient and highly repeatable measurement capabilities are needed to quickly acquire data on lead (male) and slot (female) connector positions along with size, pitch, and coplanarity ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring -  Fiber Optics

Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Fiber Optics

Metrology solutions for fiber optic interconnect components (“ferrules”) require high accuracy and throughput. One of the critical dimensions is the concentricity of the outer housing to the fiber optic center. This ensures proper interface to support high-speed communications ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Wire Bond Applications - Wire Bonding Metrology

VIEW Semiconductor Wire Bond Applications - Wire Bonding Metrology

The small features, fragile connections, and critical three-dimensionality of wire bonded assemblies require high-performance, non-contact metrology solutions. Functions such as multiple magnification, creative lighting, and advanced image processing are needed in order to measure critical features such as ball and tooling mark diameters, placement and pad alignment, and wire loop ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Wire Bond Applications - Quad Flat Packs (QFP) and Ball Grid Arrays (BGA)

VIEW Semiconductor Wire Bond Applications - Quad Flat Packs (QFP) and Ball Grid Arrays (BGA)

Quad Flat Pack (QFP) and Ball Grid Array (BGA) components represent metrology challenges with very tight tolerances that can tax the capabilities of even high performance ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Advanced Packaging Applications - Fan-out Wafer Level Packaging

VIEW Semiconductor Advanced Packaging Applications - Fan-out Wafer Level Packaging

Accurate metrology is needed in FOWLP to inspect wafer warpage, die position/alignments, flatness/coplanarity, through-silicon vias, solder microbump heights, UBM layers, RDL lines, and other alignments and features. VIEW Micro Metrology systems and software are ideal for this type of work by providing high-accuracy measurement, high-throughput speed, and production line ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Semiconductor Tooling - Inkjet Nozzle

Microelectronics Metrology Solutions for Semiconductor Tooling - Inkjet Nozzle

Measure orifice diameter and position with sub-micron accuracy. Measurement of orifice diameters Relative alignment of top/bottom orifices Orifice diameter/position measurement accuracy of < 10 nm ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Tooling Applications - Stencil Process Control

VIEW Semiconductor Tooling Applications - Stencil Process Control

Precision stencils for SMT solder paste printing represent a critical linchpin in the achievement of overall productivity and quality manufacturing results within the electronics industry. High-end metrology systems play a vital role in the assurance of the stencil quality needed for producing consistent production ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Artwork and Bare Boards

VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Artwork and Bare Boards

Inspection and process control for maintaining quality assurance over PCB artwork and bare-boards represent especially challenging requirements for metrology ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - Solder Paste Metrology

VIEW Printed Circuit Board (PCB) Inspection Applications - Solder Paste Metrology

Mis-registration of solder paste relative to printed circuit board pads is one of the leading causes of scrap and rework in surface mount technology (SMT) board assembly. In addition, height and volume measurements are crucial to new process development and to the optimization of existing ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - HDD ETCH Dimension

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - HDD ETCH Dimension

Precision etch dimension measurement of hard disk heads. In order to reliably produce hard disk heads with proper performance, a disk head manufacturer must be able to measure the etch dimensions accurately. The required precision can be on the order of a few tenths of a micron or less, requiring nanometer-level detection of the pole tip and the locations of the various edges of the etched steps. ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)

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