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Xprt Product Applications In Singapore
1,672 applications found
Compacting 10% more is interesting. Not just the machine. The life expectancy of a landfill can be extended by several years with a TANA landfill compactor that offers at least a 10% better compaction rate than any competitor – guaranteed. Savings in operating costs are easy to achieve with less driving passes, as well as reduced fuel consumption and working hours. The combination of a longer life expectancy for the landfill and lower operating costs makes a big difference for the bottom line over the ...
ByTana Oy based in  Jyvaskyla, FINLAND
The ability to provide integrated ROV/USV solutions to customers gives us the unique ability to provide a multitude of sensor options for almost every type of survey application. With our ROVs and USVs, you can explore great depths and gather information with sonar, videographics, current profiles, bathymetry, or a whole collection of other types of sensing ...
ByDeep Ocean Engineering, Inc. based in  San Jose, CALIFORNIA (USA)
Gas collection from a designated height and location (e.g. near the gas emission ...
BySoarability Pte. Ltd. based in  , SINGAPORE
Eliminate Liquid Discharge to the Environment: Zero Liquid Discharge (ZLD) is a strategic, wastewater management system facilities adopt to avoid discharging industrial wastewater into the environment. This is an engineered approach to water treatment, resulting in water recycle, recovery and reuse. Kurita America has developed a five-phase approach to zero liquid discharge projects, allowing our team to engineer the optimal system for industrial facilities. We model and combine various technologies including ...
ByKurita America Inc. based in  Minneapolis, MINNESOTA (USA)
Flip chip processes present a number of critical metrology challenges including the need for precise three-dimensional measurements to accurately inspect pad size, position, and distance from the package edges as well as confirming acceptable flatness and ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Measure a wide variety of critical dimensions on MEMS devices, including pitch, width, and spacing of flexures, fingers, combs, arcs, circle diameters, and center locations. Because of the myriad of requirements for MEMS devices, they can range from a few microns in size to a few millimeters. ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
As the leader in microelectronics metrology solutions for more than two decades, VIEW brings together the applications awareness and metrology expertise needed to address even the most demanding interconnection challenges with proven platforms. Some of the specific microelectronics interconnection applications that are addressed by VIEW solutions are listed ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
The effective inspection of PCB connectors requires metrology solutions that can accurately measure a wide variety of connector dimensions while providing the fast cycle times and throughput required for high-volume near in-line production-oriented processes. Efficient and highly repeatable measurement capabilities are needed to quickly acquire data on lead (male) and slot (female) connector positions along with size, pitch, and coplanarity ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Metrology solutions for fiber optic interconnect components (“ferrules”) require high accuracy and throughput. One of the critical dimensions is the concentricity of the outer housing to the fiber optic center. This ensures proper interface to support high-speed communications ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
The small features, fragile connections, and critical three-dimensionality of wire bonded assemblies require high-performance, non-contact metrology solutions. Functions such as multiple magnification, creative lighting, and advanced image processing are needed in order to measure critical features such as ball and tooling mark diameters, placement and pad alignment, and wire loop ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Quad Flat Pack (QFP) and Ball Grid Array (BGA) components represent metrology challenges with very tight tolerances that can tax the capabilities of even high performance ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Accurate metrology is needed in FOWLP to inspect wafer warpage, die position/alignments, flatness/coplanarity, through-silicon vias, solder microbump heights, UBM layers, RDL lines, and other alignments and features. VIEW Micro Metrology systems and software are ideal for this type of work by providing high-accuracy measurement, high-throughput speed, and production line ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Measure orifice diameter and position with sub-micron accuracy. Measurement of orifice diameters Relative alignment of top/bottom orifices Orifice diameter/position measurement accuracy of < 10 nm ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Precision stencils for SMT solder paste printing represent a critical linchpin in the achievement of overall productivity and quality manufacturing results within the electronics industry. High-end metrology systems play a vital role in the assurance of the stencil quality needed for producing consistent production ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Inspection and process control for maintaining quality assurance over PCB artwork and bare-boards represent especially challenging requirements for metrology ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Mis-registration of solder paste relative to printed circuit board pads is one of the leading causes of scrap and rework in surface mount technology (SMT) board assembly. In addition, height and volume measurements are crucial to new process development and to the optimization of existing ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Precision etch dimension measurement of hard disk heads. In order to reliably produce hard disk heads with proper performance, a disk head manufacturer must be able to measure the etch dimensions accurately. The required precision can be on the order of a few tenths of a micron or less, requiring nanometer-level detection of the pole tip and the locations of the various edges of the etched steps. ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Production inspection of hard drive Head Gimbal Assemblies (HGAs) requires the accurate measurement of a number of critical factors to meet tight tolerances. These include pitch and roll angles, slider positioning, and slider orientation/alignment ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Slider inspection is a critical data storage manufacturing process that presents difficult challenges from a metrology perspective. Slider inspection requires the acquisition and measurement of relatively small feature sizes with tight tolerances while also demanding short cycle times to provide high throughput for large production ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Inspection of data storage flexure suspension assemblies requires extremely accurate and repeatable metrology capabilities, along with special features such as integrated laser auto-focus, versatile lighting, multiple magnifications, and highly programmable ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)