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Xprt Product Applications In USA
11,115 applications found
Flip chip processes present a number of critical metrology challenges including the need for precise three-dimensional measurements to accurately inspect pad size, position, and distance from the package edges as well as confirming acceptable flatness and ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Measure a wide variety of critical dimensions on MEMS devices, including pitch, width, and spacing of flexures, fingers, combs, arcs, circle diameters, and center locations. Because of the myriad of requirements for MEMS devices, they can range from a few microns in size to a few millimeters. ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
As the leader in microelectronics metrology solutions for more than two decades, VIEW brings together the applications awareness and metrology expertise needed to address even the most demanding interconnection challenges with proven platforms. Some of the specific microelectronics interconnection applications that are addressed by VIEW solutions are listed ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
The effective inspection of PCB connectors requires metrology solutions that can accurately measure a wide variety of connector dimensions while providing the fast cycle times and throughput required for high-volume near in-line production-oriented processes. Efficient and highly repeatable measurement capabilities are needed to quickly acquire data on lead (male) and slot (female) connector positions along with size, pitch, and coplanarity ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Metrology solutions for fiber optic interconnect components (“ferrules”) require high accuracy and throughput. One of the critical dimensions is the concentricity of the outer housing to the fiber optic center. This ensures proper interface to support high-speed communications ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
The small features, fragile connections, and critical three-dimensionality of wire bonded assemblies require high-performance, non-contact metrology solutions. Functions such as multiple magnification, creative lighting, and advanced image processing are needed in order to measure critical features such as ball and tooling mark diameters, placement and pad alignment, and wire loop ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Quad Flat Pack (QFP) and Ball Grid Array (BGA) components represent metrology challenges with very tight tolerances that can tax the capabilities of even high performance ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Accurate metrology is needed in FOWLP to inspect wafer warpage, die position/alignments, flatness/coplanarity, through-silicon vias, solder microbump heights, UBM layers, RDL lines, and other alignments and features. VIEW Micro Metrology systems and software are ideal for this type of work by providing high-accuracy measurement, high-throughput speed, and production line ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Measure orifice diameter and position with sub-micron accuracy. Measurement of orifice diameters Relative alignment of top/bottom orifices Orifice diameter/position measurement accuracy of < 10 nm ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Precision stencils for SMT solder paste printing represent a critical linchpin in the achievement of overall productivity and quality manufacturing results within the electronics industry. High-end metrology systems play a vital role in the assurance of the stencil quality needed for producing consistent production ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Inspection and process control for maintaining quality assurance over PCB artwork and bare-boards represent especially challenging requirements for metrology ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Mis-registration of solder paste relative to printed circuit board pads is one of the leading causes of scrap and rework in surface mount technology (SMT) board assembly. In addition, height and volume measurements are crucial to new process development and to the optimization of existing ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Precision etch dimension measurement of hard disk heads. In order to reliably produce hard disk heads with proper performance, a disk head manufacturer must be able to measure the etch dimensions accurately. The required precision can be on the order of a few tenths of a micron or less, requiring nanometer-level detection of the pole tip and the locations of the various edges of the etched steps. ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Production inspection of hard drive Head Gimbal Assemblies (HGAs) requires the accurate measurement of a number of critical factors to meet tight tolerances. These include pitch and roll angles, slider positioning, and slider orientation/alignment ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Slider inspection is a critical data storage manufacturing process that presents difficult challenges from a metrology perspective. Slider inspection requires the acquisition and measurement of relatively small feature sizes with tight tolerances while also demanding short cycle times to provide high throughput for large production ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Inspection of data storage flexure suspension assemblies requires extremely accurate and repeatable metrology capabilities, along with special features such as integrated laser auto-focus, versatile lighting, multiple magnifications, and highly programmable ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Precision cutting tools such as end mills represent especially difficult process control challenges for metrology systems because they require extremely precise features, dimensions, and cutting surfaces in order to deliver consistent results when deployed within demanding machining ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
The accurate measurement of precision watch components places a number of special challenges on metrology systems used for inspection and process control. The small part sizes, variety of shapes, different gear geometries, and tight clearance specifications are all critical considerations when designing a metrology application for process control and inspection of watch ...
ByVIEW Micro Metrology based in  Rochester, NEW YORK (USA)
Your datacenter was designed with the future in mind. Your Energy Monitoring System should match the technology of your high-performance white ...
ByNova Power Cloud Solutions Inc based in  Beverly, MASSACHUSETTS (USA)
Electric utilities are making progress on the transition to an autonomous grid. Machfu solutions allow utilities to connect a smart network of outage detecting sensors to existing SCADA systems, making the transition faster and more cost ...
ByMachfu Inc. based in  Rockville, MARYLAND (USA)