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Xprt Product Applications In Vietnam

694 applications found
In VietnamAvailable In VietnamNear Vietnam

Industrial Waste Shredders for Waste to energy

Industrial Waste Shredders for Waste to energy

Getting energy from waste materials is good business. Choose a reliable machine for the job. Waste can be used to generate electricity and heat, but different types of waste require different types of processing before incineration in the power plant. The versatile TANA Shark shredder makes it possible to process many different types of waste materials with a single machine. The secret of TANA industrial waste shredders is the unique TANA Control System. With TCS you can optimize your TANA shredder for different ...

ByTana Oy  based in  Jyvaskyla, FINLAND


Landfill Compactor for Landfill Operations

Landfill Compactor for Landfill Operations

Compacting 10% more is interesting. Not just the machine. The life expectancy of a landfill can be extended by several years with a TANA landfill compactor that offers at least a 10% better compaction rate than any competitor – guaranteed. Savings in operating costs are easy to achieve with less driving passes, as well as reduced fuel consumption and working hours. The combination of a longer life expectancy for the landfill and lower operating costs makes a big difference for the bottom line over the ...

ByTana Oy  based in  Jyvaskyla, FINLAND


VIEW Semiconductor Advanced Packaging Applications - Flip Chip

VIEW Semiconductor Advanced Packaging Applications - Flip Chip

Flip chip processes present a number of critical metrology challenges including the need for precise three-dimensional measurements to accurately inspect pad size, position, and distance from the package edges as well as confirming acceptable flatness and ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Advanced Packaging Applications - MEMS

VIEW Semiconductor Advanced Packaging Applications - MEMS

Measure a wide variety of critical dimensions on MEMS devices, including pitch, width, and spacing of flexures, fingers, combs, arcs, circle diameters, and center locations. Because of the myriad of requirements for MEMS devices, they can range from a few microns in size to a few millimeters. ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Connector Measurement

Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Connector Measurement

As the leader in microelectronics metrology solutions for more than two decades, VIEW brings together the applications awareness and metrology expertise needed to address even the most demanding interconnection challenges with proven platforms. Some of the specific microelectronics interconnection applications that are addressed by VIEW solutions are listed ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Connectors

VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Connectors

The effective inspection of PCB connectors requires metrology solutions that can accurately measure a wide variety of connector dimensions while providing the fast cycle times and throughput required for high-volume near in-line production-oriented processes. Efficient and highly repeatable measurement capabilities are needed to quickly acquire data on lead (male) and slot (female) connector positions along with size, pitch, and coplanarity ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring -  Fiber Optics

Microelectronics Metrology Solutions for Electronic Assembly Calibration & Monitoring - Fiber Optics

Metrology solutions for fiber optic interconnect components (“ferrules”) require high accuracy and throughput. One of the critical dimensions is the concentricity of the outer housing to the fiber optic center. This ensures proper interface to support high-speed communications ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Wire Bond Applications - Wire Bonding Metrology

VIEW Semiconductor Wire Bond Applications - Wire Bonding Metrology

The small features, fragile connections, and critical three-dimensionality of wire bonded assemblies require high-performance, non-contact metrology solutions. Functions such as multiple magnification, creative lighting, and advanced image processing are needed in order to measure critical features such as ball and tooling mark diameters, placement and pad alignment, and wire loop ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Wire Bond Applications - Quad Flat Packs (QFP) and Ball Grid Arrays (BGA)

VIEW Semiconductor Wire Bond Applications - Quad Flat Packs (QFP) and Ball Grid Arrays (BGA)

Quad Flat Pack (QFP) and Ball Grid Array (BGA) components represent metrology challenges with very tight tolerances that can tax the capabilities of even high performance ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Advanced Packaging Applications - Fan-out Wafer Level Packaging

VIEW Semiconductor Advanced Packaging Applications - Fan-out Wafer Level Packaging

Accurate metrology is needed in FOWLP to inspect wafer warpage, die position/alignments, flatness/coplanarity, through-silicon vias, solder microbump heights, UBM layers, RDL lines, and other alignments and features. VIEW Micro Metrology systems and software are ideal for this type of work by providing high-accuracy measurement, high-throughput speed, and production line ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Semiconductor Tooling - Inkjet Nozzle

Microelectronics Metrology Solutions for Semiconductor Tooling - Inkjet Nozzle

Measure orifice diameter and position with sub-micron accuracy. Measurement of orifice diameters Relative alignment of top/bottom orifices Orifice diameter/position measurement accuracy of < 10 nm ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Semiconductor Tooling Applications - Stencil Process Control

VIEW Semiconductor Tooling Applications - Stencil Process Control

Precision stencils for SMT solder paste printing represent a critical linchpin in the achievement of overall productivity and quality manufacturing results within the electronics industry. High-end metrology systems play a vital role in the assurance of the stencil quality needed for producing consistent production ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Artwork and Bare Boards

VIEW Printed Circuit Board (PCB) Inspection Applications - PCB Artwork and Bare Boards

Inspection and process control for maintaining quality assurance over PCB artwork and bare-boards represent especially challenging requirements for metrology ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


VIEW Printed Circuit Board (PCB) Inspection Applications - Solder Paste Metrology

VIEW Printed Circuit Board (PCB) Inspection Applications - Solder Paste Metrology

Mis-registration of solder paste relative to printed circuit board pads is one of the leading causes of scrap and rework in surface mount technology (SMT) board assembly. In addition, height and volume measurements are crucial to new process development and to the optimization of existing ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - HDD ETCH Dimension

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - HDD ETCH Dimension

Precision etch dimension measurement of hard disk heads. In order to reliably produce hard disk heads with proper performance, a disk head manufacturer must be able to measure the etch dimensions accurately. The required precision can be on the order of a few tenths of a micron or less, requiring nanometer-level detection of the pole tip and the locations of the various edges of the etched steps. ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Head Gimbal Assembly HGA Inspection

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Head Gimbal Assembly HGA Inspection

Production inspection of hard drive Head Gimbal Assemblies (HGAs) requires the accurate measurement of a number of critical factors to meet tight tolerances. These include pitch and roll angles, slider positioning, and slider orientation/alignment ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Slider Inspection

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Slider Inspection

Slider inspection is a critical data storage manufacturing process that presents difficult challenges from a metrology perspective. Slider inspection requires the acquisition and measurement of relatively small feature sizes with tight tolerances while also demanding short cycle times to provide high throughput for large production ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Suspension Flexure Inspection

Microelectronics Metrology Solutions for Hard Disc Drive Component Metrology - Suspension Flexure Inspection

Inspection of data storage flexure suspension assemblies requires extremely accurate and repeatable metrology capabilities, along with special features such as integrated laser auto-focus, versatile lighting, multiple magnifications, and highly programmable ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Precision Micro-Grinding - End-Mill Cutting Tools

Microelectronics Metrology Solutions for Precision Micro-Grinding - End-Mill Cutting Tools

Precision cutting tools such as end mills represent especially difficult process control challenges for metrology systems because they require extremely precise features, dimensions, and cutting surfaces in order to deliver consistent results when deployed within demanding machining ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)


Microelectronics Metrology Solutions for Precision Micro-Grinding - Watch Components

Microelectronics Metrology Solutions for Precision Micro-Grinding - Watch Components

The accurate measurement of precision watch components places a number of special challenges on metrology systems used for inspection and process control. The small part sizes, variety of shapes, different gear geometries, and tight clearance specifications are all critical considerations when designing a metrology application for process control and inspection of watch ...

ByVIEW Micro Metrology  based in  Rochester, NEW YORK (USA)

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