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Electron Microscopy Articles & Analysis: This-Year
3 articles found
Wire bonding remains one of the most widely used semiconductor interconnect technologies, supporting applications ranging from power electronics and automotive devices to memory packages and legacy logic. Shrinking wire diameters, combined with material variability across aluminum and copper to gold and palladium coated alloys, have increased inspection complexity, particularly for measuring wire ...
What is Wafer Metrology? Wafer metrology refers to the precise measurement and analysis of semiconductor wafers used in the manufacturing of integrated circuits (ICs) and other electronic devices. It involves assessing various characteristics of wafers, such as dimensions, surface morphology, and material properties, using specialized techniques and instruments. Importance of Wafer Metrology ...
Here, PLA-TiO2 membranes were prepared by phase inversion using Cyrene, a bio-based solvent that lowers environmental impact while yielding robust membranes. Scanning electron microscopy revealed a porous PLA structure with TiO2 well distributed on the surface, and optical measurements confirmed the expected UV response of the immobilized photocatalyst. ...