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Semilab - Model COREMA-2000 -Contactless Resistivity Mapping
The COREMA-2000 series offers precise, non-destructive, contactless resistivity measurement solutions designed primarily for semi-insulating compound semiconductors such as SiC, GaN, GaAs, CdTe, GaO, and InP. It supports both research and industrial semiconductor manufacturing environments with high accuracy and repeatability.
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- Resistivity mapping and uniformity assessment of compound semiconductor wafers before chip fabrication
- Quality control of incoming wafers in semiconductor production lines
- Real-time process monitoring of high-resistivity substrates in RF, optoelectronics, photonics, military, aerospace, and power device manufacturing
- Applicable to materials such as GaAs, SiC, GaN, GaO, CdTe, InP, and other semi-insulating substrates
- Original developer of the SEMI standard and leading global support network
- Fully compliant with SEMI M87-0422 industry standard for non-contact resistivity measurement
- Trusted and deployed globally in 14+ countries
- No calibration needed for routine operation
- User-friendly graphical interface with colored topographic display
- Non-contact, non-destructive full-wafer resistivity measurement
- Excellent measurement repeatability and wide measurement range
- Measurement Principle: Contactless capacitance technique for full-water resistivity characterization across a very wide range in the semi-insulating region
- Operator & Automation:
- Full automation supported on request (especially Corema-2201 model with robotic wafer handling)
- Measurement parameters and process sequences fully customizable
- Semi-automatic wafer placement
- Data & Software:
- Built-in software provides detailed wafer maps and resistivity profiles
- Customizable reporting tailored to industry standards with data available in various formats; Semilab internal format, TXT, and PDF
- Excellent repeatibility, <1%* (*:get in touch for further details),
- Sample Surface: Etched or polished, as-cut or bare wafer,
- Sample size up to 200 mm diameter,
- Minimum sample size: 10 x 10 mm shard for single point measurement,
- Wide measurement range: 105to 10¹² Ω·cm
- Measurement parameters:
- Full wafer topogram with up to 1024x1024 data points
- Fast evaluation
- Wafer diameter: up to 200 mm
- Manual wafer handling
- Automatic non-contact adjustment
- Mapping capability
