Model Series 53 -Wire Bonder

5310 – Gold-Ball

• Gold-Ball-Bonding for wires from 17,5 to 50 μm using Standard-Capillaries 16 mm to 19 mm
• Dual frequency-US-generator for 60/100 kHz – further Bondfrequencies available on request
• Bumping, Safety-Bump, Stitch-on-Ball
• Programmable Z-Axis 60mm

5330 – Thin Wire Wedge-Wedge

• Wedge-Wedge-Bonding with 1“ Tools for Aluminum- and Goldwires from 17,5 to 75 μm and ribbon up to 250 x 25 μm
• 45° wireguide, retrofitable to 30° and 60° – according to component geometry
• Dual frequency-US-generator for 60/100 kHz further Bondfrequencies available on request
• Programmable Z-Axis 60 mm and Y-Axis 25 mm

53XX BDA – Ball-Deep Access

• Deep Access Wedge-Wedge-Bonding with 1“ or ¾“ Tools
• 90° wireguide for Aluminum- and Goldwires from 17,5 to 75 μm
• Gold-Ball-Bonding for wires from 17,5 to 50 μm with capillaries 16 -19 mm
• Perfect for difficult and constricted bonding geometries
• Also useable for ribbon of aluminum und gold
• Programmable Z-Axis 60 mm and Y-Axis 25 mm
• optional: retrofitable to 5380 DIE-Bonder

5350 – Heavy Wire

• Heavy wire bonding for aluminum wire from 100 up to 500 µm diameter
• Heavy wire bonding for copper wire from 100 up to 300 µm diameter
• Wedge-Tool length from 50 to 70 mm also for extreme bonding requirements
• Stitch- or chain bonds of any length
• Clip-on-wire guide for quick exchange
• Programmable Z-Axis 60mm and Y-Axis 25 mm

5350 HR – Heavy Ribbon

• Heavy Ribbon bonding for aluminum ribbons up to 2 mm width
• Increased programmable bond force up to 6,000 cN, also with force and power ramps
• Active ribbon guide to improve loop shaping
• Programmable Z-Axis 60mm and Y-Axis 25 mm
• Optional: retrofitable to 5350 HR heavy ribbon bondhead

5380 – DIE-Bonder

• Different DIE-sizes process oriented useable
• Manual DIE-bonding with Touchdown-Detection and programmable pickup- and bond force
• 2 x 2“ working area for any Waffle-, Gel-Packs or Trays
• Bond- and pickup force from 5 up to 500 cN programmable