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Wire Bonder Equipment & Supplies
5 equipment items found
Manufactured by:F&S BONDTEC Semiconductor GmbH based inBraunau, AUSTRIA
Complete, manual table top bonder, Unbeatable price-to-performance ratio, Extremely adaptable bond settings, loop shapes, force and power profiles etc., Dual wire clamp system for reproduceable loop and tails, Easy ...
Manufactured by:F&S BONDTEC Semiconductor GmbH based inBraunau, AUSTRIA
Unbeatable flexibility, Changeable bondheads for all wirebond and testing process, Fully automatic bonding with manual part feeding, Store an unlimited number of bond programs, Extremely adaptable bond settings, loop shapes, force and power profiles etc., Most powerful pattern recognition system on the market, Innovative and intuitiv programmable software, Travel distances 100 x 100 mm, 6 in ...
Manufactured by:Daitron Incorporated based inWilsonville, OREGON (USA)
From scribe and break systems to chip and can testers and aging systems, plus visual inspection systems, we manufacturer what you need. We also represent FourTechnos wire bonders and Nikke can ...
Manufactured by:F&S BONDTEC Semiconductor GmbH based inBraunau, AUSTRIA
The semi-automatic bond tester 5600i complements F&S’s die and wire bonders. The PC controlled moving table allows any number of bonds to be tested automatically from a stored program. Results can be analysed and output immediately or exported in a number of data base formats for subsequent analysis as desired. ...
Manufactured by:F&S BONDTEC Semiconductor GmbH based inBraunau, AUSTRIA
The automatic bond tester 5600Ci complements F&S Bondtec Semiconductor GmbH die- and wire-bonders. It is unique on the world market and patented. The PC controlled moving table allows any number of bonds to be tested automatically from a stored program. Results can be analysed and output immediately or exported in a number of data base formats for subsequent ...