CN1 - Atomic Layer Deposition (Atomic-Classic)

Substrate Size : 4 ~ 8” Standard (Wafer). Thermal ALD Process. Laminar Gas Flow (Side Gas Flow). Gas Delivery System : Bubbler, LDS etc. Low Particle Generation. Small Volume for Process. Available Laminated & Mixed Process. Easy User Interface & Maintenance. Max Temperature : 450 ? (@ Wafer). No. of Precursor Canisters : Up to 4 Sets (Standard).